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  • TDA4AP-Q1: No Boot Log Printing After 900 Times Power on & off

    Part Number: TDA4AP-Q1 Tool/software: Hi TI Experts, Customer is working on TDA4AP SDK9.2. They are going to SOP at the end of this month, and doing the final pressure test. They have 1 board which could boot from emmc successfully over 900 times. However…
    • Answered

  • TDA4AP-Q1: QOS Register Reserved Bits

    Resolved
    Part Number: TDA4AP-Q1 Tool/software: Hi TI Experts, Customer is working on TDA4AP SDK9.2. As we could find on the register manual for the register 0x03702010, only bit 0 and bit 1 are used, and the rest of the other bits are reserved. However, inside…
    • Resolved
    • Answered

  • TDA4AP-Q1: ESM Module Integration Theory

    Resolved
    Part Number: TDA4AP-Q1 Tool/software: Hi TI Experts, Customer is working on TDA4AP SDK9.2. Question 1: They want to know the meaning of the below two ESM error. MCU ESM error bit 95: SDLR_MCU_ESM0_ESM_LVL_EVENT_GLUELOGIC_ESM_MAIN_ERR_GLUE_ERR_I_N_0 …
    • Resolved
    • Answered

  • TDA4AP-Q1: The Meaning of MCU ESM Error MASTER_SAFETY_GASKET40_TIMED_OUT_0

    Resolved
    Part Number: TDA4AP-Q1 Tool/software: Hi TI Experts, Customer is working on their own TDA4AP board with SDK9.2. They meet the following MCU ESM error MASTER_SAFETY_GASKET40_TIMED_OUT_0 . Customer would like to know the meaning of this error and in which…
    • Resolved

  • TDA4AP-Q1: What is ESM Error SDLR_ESM0_ESM_LVL_EVENT_PLLFRACF2_SSMOD3_LOCKLOSS_IPCFG_0

    Part Number: TDA4AP-Q1 Tool/software: Hi TI Experts, Customer is working on TDA4AP SDK9.2 customer board. When they do the soft reset, they will have ESM error SDLR_ESM0_ESM_LVL_EVENT_PLLFRACF2_SSMOD3_LOCKLOSS_IPCFG_0 . We could only know this ESM error…
    • Answered

  • TDA4AP-Q1: Certification of MCAL Modules hw_include & Bsw_Stubs

    Resolved
    Part Number: TDA4AP-Q1 Tool/software: Hi TI Experts, Customer is working on TDA4AP SDK9.2. They found that our MCAL modules hw_include & Bsw_Stubs have not been certificated yet. May I know does that mean customer needs to get the certification o…
    • Resolved
    • Answered

  • TDA4AP-Q1: Is Signing Remote Core Firmware Must Required on HS-FS Devices

    Resolved
    Part Number: TDA4AP-Q1 Tool/software: Hi TI Experts, Customer is working on TDA4AP SDK9.2. According to the following guide at section 9.8.7 , there are some additional steps to use both HS-FS & HS-SE devices. https://software-dl.ti.com/jacinto7…
    • Resolved

  • TDA4AP-Q1: Grounding of the package lid; EMC testing

    TI Thinks Resolved
    Part Number: TDA4AP-Q1 Tool/software: Hello TI Support, Is the metal cover (of the ALY1414A package) grounded? Did the device had passed radiated emission/immunity testing? Does TI test ESD on the lid? Thanks a lot, Sharon.

  • TDA4AP-Q1: EB Not Support MCU4_0 in Some Modules

    Part Number: TDA4AP-Q1 Tool/software: Hi TI Experts, Customer is working on TDA4AP SDK9.2. We had some previously discussion in the below link. https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1364182/tda4vh-q1-could-mcu4-0-support…

  • TDA4AP-Q1: Limitations for Configuration for SERDES Lanes when using QSGMII / SGMII and SGMII/ USB3 mixed

    TI Thinks Resolved
    Part Number: TDA4AP-Q1 Other Parts Discussed in Thread: SYSCONFIG Tool/software: Hello, as also asked in PROCESSOR-SDK-J784S4: SerDes Configuration - Processors forum - Processors - TI E2E support forums from SW perspective. We wanted to use the following…

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