Walter,
Yes indeed you are correct. I was basing my previous comment on the TIDM-FRAM-IRREFLECTIONSENSING BOM which seems to have a mistake because it references the TSSOP20 device footprint.
Regardless of the actual device used for the design, my previous…
Hello Vishal,
Please see the following:
https://e2e.ti.com/support/microcontrollers/msp-low-power-microcontrollers-group/msp430/f/msp-low-power-microcontroller-forum/669010/msp430fr2433-latest-dali-2-0-on-msp430-fram
https://www.ti.com/lit/slaa422
…
Part Number: TIDM-FRAM-IRREFLECTIONSENSING Hi TI Team,
We used the reference design for our product with everything the same in hardware and firmware.
But, we are getting too board variation in ADC output.
Example: light average reading will flactuate…
Part Number: TIDM-FRAM-EEPROM Hi community member,
I have a question about the SPI clock of TIDM-FRAM-EEPROM.
<Question> 1. Do you think it is possible to design for faster SPI clock (eg 10 MSPS)? My customer wants to communicate at speeds faster…
I'm Using the FRAM Utility Library version 02.00.00.15. I just got all the files to compile and all seems ok until I come out of LPM3.5. I'm having problem getting my target to operate properly after coming out of LPM3.5, one of my peripheral devices…
Other Parts Discussed in Thread: TIDM-RF430-TEMPSENSE , RF430FRL152HEVM , RF430FRL152H Hi,
Can I change the entire 2KB FRAM data with custom data through SPI or I2C protocol externally in the TIDM-RF430-TEMPSENSE sensor patch?
Part Number: TIDM-RF430-TEMPSENSE Hi,
Can I change the entire 2KB FRAM data with custom data through SPI or I2C protocol externally in the sensor patch?
Other Parts Discussed in Thread: MSP430FR2433 Hi,
My team recently supported a customer issue regarding compiling code that uses the .TI.persistent section. On compiler v15 this project compiled clean. However, with v21.6.0 LTS it fails with this message…
Hello,
Also please take a look at the Compute Through Power Loss (CTPL) library in the FRAM Utilities . It was made for this type of scenario and can help you with your application by being able to resume your application were it left off instead of full…