Part Number: TLC77 Other Parts Discussed in Thread: TPS3704 Hi,
We currently use TLC7705IPW to reset a CPLD and microcontroller that run on 5V. Therefore, the TLC7705IPW is setup with a Vdd of 5V and output 5V logic.
We are moving to a CPLD that now…
Part Number: TLC77 Hi team,
Could you tell the abs max ratings of RESET pin of the device?
Customer wants to connect TLC7701 Rest pin to LT3099 EN pin. LT3099 is negatvie voltage LDO. They found that EN pin of LT3099 goes to -0.5V when negative…
Part Number: TLC77 Tool/software: Hello,
For the TLC7705QD, the datasheet SLVS087M, shows that the unit of measure for both Fall Time and Settling Time is ns/V. Is this correct? The parameter appears to be a rate of change and not a time measurement…
Part Number: TLC77-EP
Hello,
I would like to request additional bonding‑related data for the TLC7705QD device (copper bond wire variant). Specifically:
Do you have measurements or characterization of the Intermetallic Compound percentage (IMC…
Part Number: TLC77 Tool/software: Greetings
Questions related to TLC7705QD device
For the switching characteristics I need to confirm if all propagation delay times are tested across temperature during production.
Part Number: TLC77 Tool/software: Hello,
Can you please confirm if part PN TLC7705QD is under statistical control.
If it is, can you provide a list or a document that details the Statistical control processes of part PN TLC7705QD
Thanks,
…
Part Number: TLC77 Tool/software: Greetings
Currently we are testing Pat# TLC7705QD (non military grade )Power supply monitor and need to clarify the following
In the switching characteristics table, the Delay Time is specified at 25C with limits…
Part Number: TLC77 Tool/software: Hello,
PN TLC7705QD bondwire changed from Au to Cu per PCN # 20120808000 issued from CY 2012. The part mass changed because of this bondwire change ? If it did, please provide the mass of device with gold bond wire…
Part Number: TLC77 Tool/software: Hello,
PN TLC7705QD bondwire changed from Au to Cu per PCN # 20120808000. This change affected the dimensions of the SOIC package ? This change affected something else on the device besides the bond wire material…
