Part Number: TMP461-SP Other Parts Discussed in Thread: TMP461
From page 6 of the datasheet, the data setup (t(HDDAT)) and hold time (t(SUDAT)) is defined for writes on the SMBus. I need to know what the setup and hold time will be for the read cycle…
Part Number: TMP461 Dear ，
customer said they ordered the full part number TMP461AIRUNT, but now they order the full part number is TMP461AIRUNT-S;I check that the datasheet shows that it only is TMP461AIRUNT-S,;
so could you tell me the difference between…
Part Number: TMP461-SP We are having some testing issues with our TMP461-SP device. Debugging has lead me to need to know how the D- pin is connected in the device and if there is any ESD protection devices on it.
What is D- connected to in the device…
Part Number: TMP461 Other Parts Discussed in Thread: TMP102 , TMP117 , TMP1075 , TMP112 Hi team,
My customer is looking for outside the box temperature sense of small cell in 5G application.
I find the remote sensor of TMP461. Do we have the reference design…
Part Number: TMP461 Dear Sir/Madam,
I have look thru both TMP461 and TMP461-SP datasheet, both components have the same identical functional block, the different is the package.
1) I would like to find out what is the wafer technologies node for both…
Part Number: TMP461-SP Is there a typo in the TMP461-SP datasheet? "Short-circuit" should be "Open-circuit".
7.3.5 SensorFault
The TMP461-SPdevice can sense a fault at the D+ input resulting from an incorrect diode connection. The…
Part Number: TMP461 The datasheet has no specification for performance over time. Is that because of the topology, e.g. the current sources do not change greatly over time and the ADC is purely a digital function, requiring no onboard reference?
Part Number: TMP461-SP Hi experts!
I'm looking for the reliability/qualification report for the TMP461-SP HKU package to address my customer's question.
"Would you please let me know if TI recommends body soldering the following device? If…
