Part Number: TS5A63157 Do you use Ni as the undercoat for TS5A63157DBVR products whose lead finish material is Sn? Also, is the outermost layer plating thickness 10 μm or more, or less than 10 μm?
Part Number: TS5A63157 Customers have asked the following questions to register their products. Can you give me more details?
Material: TS5A63157DBVR
1. Use Ni for grounding or not. : Yes / No
2. Thickness of outermost layer plating : 10 μm or more …
Part Number: TS5A3159A Other Parts Discussed in Thread: TS5A63157 , SN74LVC1G3157 Tool/software: Hi, expert:
Is TS5A3159A able to work with 20Mhz SPI signals?
Part Number: TS5A63157 Other Parts Discussed in Thread: TMUX1511 , PCA9306 We are trying to use this IC as a protection of I2C bus, in case of DSP power supply failure. We are using two pcs, for SDA and SCL line and the intention is to use “Isolation in…
Part Number: TS5A63157 Hi Team,
Our customer needs the Tj(max) for TS5A63157
The datasheets does not contain this data but it has its Tstg Max. For this part, can we use this value instead?
Thanks in advance.
Regards,
Jejomar
Hello Tiger,
It seems what you are looking for is a pin-to-pin replacement for the SN74LVC1G3157 with powered-off-protection feature.
I agree with Clemens suggestion of the TS5A63157: https://www.ti.com/lit/ds/symlink/ts5a63157.pdf
I can also suggest the…
There is no logic device that has enough drive strength at 0.75 V.
It might be possible to construct your own buffer. Use a 2:1 switch with a high bandwidth and very fast switching time (e.g., SN74LVC1G3157, SN74LVC2G53, TS5A63157), connect one input…
Hi Vishnu,
Clemens is spot on here. You're experiencing a degree of backpowering here. To avoid this, a device with powered off protection is recommended to avoid the undesired operation that you demonstrated. The closest replacement is indeed the suggested…
