Part Number: UC1705-SP Other Parts Discussed in Thread: UC1707-SP Hello,
Our company currently using UC1705-SP in power module desing, and preparing documentation for desing review.
I already provided the available brochure and qualification, such…
Part Number: UC1705-SP Other Parts Discussed in Thread: UC1707-SP , Tool/software: Is there a SPICE model available for UC1705-SP and a SEE report? Can I use the UC1707-SP model/data as an equivalent substitute?
Part Number: UC1705-SP Other Parts Discussed in Thread: TPS7H1101A-SP , , TPS50601A-SP Hello,
In the UC1705-SP datasheet, the temperature is spec'd as "Operating Temperature Range”, while in our other space grade devices like TPS50601A-SP and TPS7H1101A…
Part Number: UC1705-SP Hello,
We are using the 5962-9579801M2A in our design which is essentially the UC1705-SP in the LCCC package.
We have a no floating metal requirement on the project and I want to know if the NC pins on the device are connected…
Part Number: UC1706 Other Parts Discussed in Thread: UCC27531 , UCC27614 , UC1708-SP , UC1705-SP , UC1709-SP Hi Team,
Can I use UC1706 for designing Buck-Boost converter. Is there a reference design with UC1706
Thanks&Regards
kishan
Other Parts Discussed in Thread: UC1705-SP Hi, I would like know if this Part is ITAR , and if there is no planed change of the status in the futur . Thanks , Michel
Other Parts Discussed in Thread: MKT-WG16A-MS , MKT-WG10A-MS , SN0020HKH , SN0010HKU , TPS7H1111-SP , TPS7H4011-SP , TPS7H6003-SP , SN00020FK Looking for mechanical package samples for trim and form setup
Answer:
For our Space Power Ceramic QMLV qualified…
Hi Jenny,
As far as I know, TPSM846C24 module is not specifically manufactured to withstand radiation.
You may find some SEE TI products here: e2e.ti.com/.../slyt532g.pdf
Martin,
As I mentioned previously, we do not have such information. Our Modules are for commercial use therefore those tests are not performed.
I would recommend going to ti.com, click on top left corner "Applications" and select "Aerospace & defense…
Could TI please provide guidance for how to trim/form the leads of ceramic devices and provide the PCB footprints so we can integrate into our system design?
