Other Parts Discussed in Thread: MKT-WG16A-MS , MKT-WG10A-MS , SN0020HKH , SN0010HKU , TPS7H1111-SP , TPS7H6003-SP , SN00020FK Looking for mechanical package samples for trim and form setup
Answer:
For our Space Power Ceramic QMLV qualified portfolio of devices…
Hi,
In our system, we must use NI pin with voltage level between 0V to 600 mV. Besides that, we are using UC1823A-SP so space products are essential for us. Therefore, some questions are:
1-) Is there same problem for NI pin in UC1825A-SP ?
2-) Are there…
Part Number: TPS40200-EP Other Parts Discussed in Thread: UC1825A-SP , UC1843-SP Hello,
I would like to know if SOI technology (Silicon On insulator) is used to build this part.
Before to select this part for a space application, I would like to have…
gG,
Can you look at UC1825a-sp and see if E/A and current feedback will do the trick. Alternately use an external op-amp i.e. LMP2012QML-SP in conjunction with UC1825A-SP. you can always put the internal op-amp in unity feedback and use external…
Other Parts Discussed in Thread: UC1825A , UC1825 , UC1825A-SP Hi,
UC1825 and UC1825A has below functions.
UC1825: Dual Totem Pole Outputs (Alternating) - Duty Cycle Range (%80max) - Dead-Time Control by Ct pin.
UC1825A: Dual Totem Pole Outputs (Alternating…
Hi Ramesh,
Can you tell me the criteria apart from Duty cycle limit for a dual output controller to be used in an active clamp application?
UC1825A-SP has a duty cycle up to 85%. If duty cycle is the limiting factor to be used for the active clamp application…
Other Parts Discussed in Thread: UC1825A , UC1843 , UC1846-SP I want a power supply solution with the input voltage between (18 Vin - 34 Vin) typ 24Vin , output voltage (+15 V @ 750mA and -15 V @ 750 mA ) with galvanic isolation power supply. Please help me…
Lead-times and available finished good inventory vary by device and change over time, but we are dedicated to providing quick and easy access to all our devices via TI.com.
To help provide more transparency into TI’s available inventory, in late 2020…
Could TI please provide guidance for how to trim/form the leads of ceramic devices and provide the PCB footprints so we can integrate into our system design?
