Would it be bad if we connected NC pins to the same potential as GND pin?
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Yes, normally I wouldn't do that too.
I just noticed that LMH32401 and OPA857 could be potentially combined into single design without violating PCB design guidelines too much. I know they have different characteristics, but I found out the surrounding circuit could be also adapted as an BOM variant to make it working.
They have slightly different thermal pad sizes, however I think this could work. But it would work only if NC's could be somehow used - for example pin 4. of LMH32401 is NC and OPA857 is GND - otherwise there would be just too many 0R or DNP components.
The idea is crazy enough, so I won't probably investigate too far. If I get clear answer that we are free to connect NC to whatever we want I might investigate deeper, otherwise it's probably waste of time ;)
Looking at the DIE datasheet, it looks like there is no bond-wire pad for that pin. Therefore I think it is a safe bet there is no bond wire attachment in the mold compound package either.