TLV9002: solder composition and reflow profile

Hi David,

you might want to read this document:

https://www.google.com/url?sa=t&rct=j&q=&esrc=s&source=web&cd=&cad=rja&uact=8&ved=2ahUKEwissqGz0qjxAhXz_7sIHYdWB3YQFjABegQIAxAF&url=https%3A%2F%2Fwww.ti.com%2Flit%2Fan%2Fsnoa021c%2Fsnoa021c.pdf&usg=AOvVaw28wMPkQjrxzg_G8xsvTs6h

Kai

HI Kai;

Thank you for the quick response, this looks good.  Can you advise on the percentage composisiton of the solder for Sn, Ag, and Cu?

Hi David,

The percentage of Sn, Ag, and Cu is typically found on the "Ordering and Quality" tab of the product page. Once you are on the Ordering and Quality tab you can click on the "View or download" link in the "Quality, reliability, and packaging information" column. There it will tell you, the Tin, Silver, and Copper percentages of the solder bumps.

I will email our quality team to see if we can have this information available.

Thank you,

Tim Claycomb

Hi David,

I have emailed our quality team and we are looking for the information. I'm hoping to have an answer for you by tomorrow. I'll keep you updated.

Thank you,

Tim Claycomb

Hi David,

I still don't have a definitive answer for you. Since this is a recently released device, its possible that all the information hasn't been uploaded to TI.com yet. It might be best to wait for all information to be uploaded to TI.com but I am trying to get a timeline on when we expect it to be uploaded.

Thank you,

Tim Claycomb