Within the technical data sheet for this LM139AWG/883 part is a listing of the product attributes:
| Orderable Device |
Status |
Package Type | Package | PINS | Package Qty | Eco Plan | Lead Finish/ Ball Material | MSL Peak Temp | Op Temp | Device Marking | |
| LM139AWG/883 | ACTIVE | CFP | NAC | 14 | 42 | Non-RoHS & Green | Call TI | Level-1-NA-UNLIM | -55 to 125 | LM139AWG/883 Q ACO 5962-87739 /883 Q >T |
The CALL TI section is listed under the lead finish/ball material heading.
Does anyone know what material the leads of this CFP package are composed of??? (Gold, Tin/Lead, etc...?)
This material property is required for manufacturing / solderability consideration.
