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TLV9064: Thermal pad must be connected to V_

Part Number: TLV9064

I suggest clarifying the TLV906xS data sheet concerning the pin connections. It is indicated that one should connect the thermal pad to V_, but it is not clear that the device is inoperable unless this connection is present. It is stated that the thermal pad is important for thermal and mechanical stability, but it is ambiguous whether it is essential for electrical operation. I discovered this while prototyping a design with a QFN breakout board that refused to operate correctly. Using a breakout board with vias under the thermal pad provided the necessary electrical contact point and resolved my problem. I'd recommend that this be spelled out clearly in the data sheet (specifically: an external connection from V_ to the thermal pad is MANDATORY) to save others from the lengthy troubleshooting I went through.

  • Hello Mike,

    Do you have an old version of the datasheet? If you look in the revision history of the datasheet, in May 2019, they added a note to the packages with thermal pads that the thermal pad needs to be connected to V-.

    There is a note below each package with a thermal pad saying to connect the thermal pad to V-.

    Please use ti.com to see the most recent version of the datasheet.

    Best,
    Jerry

  • Hi Jerry, my data sheet shows a last revision date of September 2019. The sentence that threw me off is: "The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance." I have used devices in the past where the thermal pad connection wasn't mandatory and this predisposed my thinking. I suggest something like: "The package thermal pad must be soldered to the printed circuit board for correct electrical operation and for optimal thermal and mechanical performance." It's not a big deal, but a few additional words here might be of benefit to others.