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TLV3691: Resin molding after SMT assembly.

Part Number: TLV3691

Hi sir,

My question is whether the resin molding process can be carried out after ICs are mounted on PCB.
I intend to carry out resin molding for waterproof after mounting TI parts on the PCB.
The environmental conditions of electronic components during resin molding are,
"Maintain these conditions for 2 hours at 175 ℃ and 10MPa"
Can the following products of your company be resin molded in such an environment?



  • Hello Frank,


    Speaking for the TLV3691:

    After assembly, the finished devices are cured at 175C for 8 hours. Seems like those chips should be crispy after that..

    Many customers "pot" their modules in epoxy and I have not heard of any issues.

    I will pass your question on to the packaging people for any comments, but I do not expect any problems.

  • Hello Frank,

    The TI devices should be fine, as long as they are unpowered at the time.

    But the Packaging folks were more concerned about the viability of the solder joints.

    However, this is outside of TI's expertise or responsibility, so you will have to defer to your encapsulation experts.