My question is whether the resin molding process can be carried out after ICs are mounted on PCB.
I intend to carry out resin molding for waterproof after mounting TI parts on the PCB.
The environmental conditions of electronic components during resin molding are,
"Maintain these conditions for 2 hours at 175 ℃ and 10MPa"
Can the following products of your company be resin molded in such an environment?