LMH6881: WQFN package questions about packaging (leads and resin molds) follow-up

FRANK1

Part Number: LMH6881

Hi Team,

is there any package engineer or product line engineer can help me on this customer query?

The customer has been asking and I can not get response from QEM.

Please check this URL.
www.nxp.com/.../AN2467.pdf

Is LMH6881SQ/NOPB 3.4.1, 3.4.2 or 3.4.3?
I think it's 3.4.1.
The LMH6881SQ/NOPB I have looks like the figure in 3.4.1.
I would like to confirm whether there is a possibility that it will be like 3.4.2 due to manufacturing variations.
The attached email you received seems to be discussing 3.4.3, is it different?

over 3 years ago

0 Sima Jalaleddine over 3 years ago

TI__Mastermind 25975 points

Hello Frank,

The LMH6881SQ/NOPB has a flat leadless package with an exposed thermal pad which is internally bonded to the ground pins. Here are some additional resources on the package: link1 and link2.

I will have to talk to a packaging expert on the specifics with regards to molds and get back to you as soon as I receive an update.

Thank you,

Sima

0 FRANK1 over 3 years ago in reply to Sima Jalaleddine

TI__Expert 8075 points

Hi Sima,

The customer mainly want to confirm whether the resin remain on the side of leads.

is this possible?

Thanks.

0 Sima Jalaleddine over 3 years ago in reply to FRANK1

TI__Mastermind 25975 points

Hello Frank,

I am unsure of this as well, but will relay this as well to the packaging expert. Will let you know once I receive a response or update you by mid next week.

Thank you,
Sima

0 FRANK1 over 3 years ago in reply to Sima Jalaleddine

TI__Expert 8075 points

Hi Sima,

Any update on this thread?

Thanks,

0 Sima Jalaleddine over 3 years ago in reply to FRANK1

TI__Mastermind 25975 points

Hello Frank,

Sorry for the delay, I have found the correct person to talk to and I've sent them an email. Expecting a response by tomorrow.

Thank you,

Sima

0 FRANK1 over 3 years ago in reply to Sima Jalaleddine

TI__Expert 8075 points

Hi Sima,

Good news.

waiting your feedback.

Thanks.

+1 Sima Jalaleddine over 3 years ago in reply to FRANK1

TI__Mastermind 25975 points

Hello Frank,

I received a response from the QFN packaging manager. Short answer: no, there is no resin that remains on the side of leads. I will send you the detailed explanation over email.

Thank you,

Sima

0 FRANK1 over 3 years ago in reply to Sima Jalaleddine

TI__Expert 8075 points

Hi Sima,

Thank you for your response.

Very helpful.

Amplifiers

Amplifiers forum

LMH6881: WQFN package questions about packaging (leads and resin molds) follow-up