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TLV3201: Amplifiers forum

Part Number: TLV3201

Hello guys,

One of my customers used a part of one reel of TLV3201AIDCK for their several products two years ago.  

Now they are going to use the remain TLV3201AIDCK of the reel for their newest product.

But the device floor time has been exceeded the limit of MSL level 2 (TLV3201AIDCK MSL level is 2) 

because they purchased the device over two years ago and it has been stored outside of moisture barrier bags (MBB).

So they want to bake the device in prior to the reflow process in order to remove any moisture out of the plastic package.

We check the following document, we couldn't find any baking time for MSL level 2 device which stored outside of MBB over two years.


Handling and Process Recommendations Application Report

Could you please tell me what the baking time for the device is?

Your reply would be much appreciated.

Best regards,


  • Hello Kazuya,

    See table 5 on page 9.

    The DCK package is 1mm thick, so it would fall into the "0.8mm to 1.4mm thickness" section on page 9.

    Note 4 says that it does not have to be baked if the temperature over time was <30°C and <60% humidity.

    If not, then I would use the "2a" line conditions (6 hours at 125°C, or 20 hours at 90°C, or 7 days at 40°C).

  • Hello Paul,

    Thank you very much for your reply.
    It is very helpful for the customer and me.

    Thank you again and best regards,