I would like to use the High temperature INA333-HT among other High temperature chip.
I am currently hesitating between the 2 packages: HKJ and HKQ.
Could you provide me the following information:
- PCB footprint advised for this 2 packages
- Manufacturing tools and process to bend the leads
- Thickness of gold applied on leads (in um)
- Main difference between these two packages
- Is there any recommendation between these two package for mechanical vibration in harsh environment?
Kind regards,