This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

INA333-HT: Lead finish, PCB footprint and assembly process

Part Number: INA333-HT

I would like to use the High temperature INA333-HT among other High temperature chip.

I am currently hesitating between the 2 packages: HKJ and HKQ.

Could you provide me the following information:

  • PCB footprint advised for this 2 packages
  • Manufacturing tools and process to bend the leads
  • Thickness of gold applied on leads (in um)
  • Main difference between these two packages
  • Is there any recommendation between these two package for mechanical vibration in harsh environment?

Kind regards,

  • Hi Eric,

    We'll need some time to collect this information, please give us to the end of this week.

    Thanks,
    Mike

  • Hi Eric,

    Thanks for being patient with us while we gathered this information for you. We are still working on the thickness of gold applied to the leads, but I thought I'd at least get back to you on what we have so far. Please see our responses below:

    • PCB footprint advised for this 2 packages
    • Manufacturing tools and process to bend the leads
    • Thickness of gold applied on leads (in um)
      • Still working on this data. 
    • Main difference between these two packages
      • The difference is in the leads - HKQ as formed, HKJ mounted dead bug
    • Is there any recommendation between these two package for mechanical vibration in harsh environment?
      • The two part epoxy adhesives  (DP100) are used in some of aerospace companies for mechanical vibration in a harsh environment tests (water proof and water soaking tests). The INA333-HT needs to be placed  as low as possible on a PCB and the white colored epoxy is bonded all around the ceramic or epoxy molding compounds (air gap needs to be filled from the bottom IC surface and PCB, all pins of the package and space between pins and pins to PCB and its perimeters). It is not necessary to cover the top of the IC. The ideas are to move or vibrate the part together (in synchronized movement) with the PCB, not relative movements from each other (PCB/fixture and IC) during mechanical vibration tests, which it may snap the pins of the any larger IC components.

        The use of epoxy adhesives are in compliance for aircraft electronics. If the parts are used for space, the customer has to find a comparable adhesive type. Every time adhesives are used, there are mechanical stress on a bonding surfaces need to be considered or monitored (similar to epoxy molding stress in IC package -> changes in Vos and other stress dependent variables). Also, there are thermal expansion coefficient., Tg are required to be considered etc.. In other words, the epoxy bonding stress can not be too large, but enough support for vibration, temperature, temperature cycles or any other harsh environmental tests.