Team,
Because of availability issues and in order to migrate between possible alternatives (OPA2348 <-> TLV9042, OPA2379 <-> TLV9002) :
-From the PCB footprint point of view are the SOT-23| 8 and SOT-23-THIN|8 package 100% compatible?
-Can a PCB for SOT-23|8 (OPA23xx) be used as is for SOT-23-Thin|8 (TLV9xxx)?
-If not can you make suggestion to accommodate both using the same footprint geometry?
Thanks in advance,
A.
Hey A.,
I must commend you on the great problem solving skills in this supply constraint environment!
The PCB footprints for SOT-23|8 (DCN) and SOT-23-Thin|8 (DDF) package are very similar and may populate on to the same PCB footprint. We do this on our SMALL-AMP-DIP-EVM, DCN and DDF packages share "footprint" B. So you may confirm this yourself, I have linked the package drawing for both: DCN and DDF.
I have highlighted the main differences between the packages, both of which do not prevent the PCB second source.
Finally, I would also like to recommend the "Second-sourcing options for small-package amplifiers" by Tim Claycomb for more considerations.
All the best,
Carolina
