OPA2277-EP: MSL Problem and Baking

Eren Erdogan

Intellectual 280 points

Part Number: OPA2277-EP

Hello TI,

We plan to buy OPA2277MDTEP. MSL rating of this product is 3. The supplier's message is as follows:

“Our stock of Part Number OPA2277MDTEP is not Dry Packed, please be aware that these parts may contain moisture.”

Can we use this product after baking? Is there probability of having trouble?

Regards,

Eren

over 2 years ago

+1 kai klaas69 over 2 years ago

Guru 140200 points

Hi Eren,

hhm, this doesn't sound good. Take care, wrong storage conditions can result in internal corrosion and degraded solderability.

Are the chips from a TI's authorized distributor? If not, there's even the risk that you buy a fake chip.

Kai

+1 Thomas Kuehl over 2 years ago

TI__Guru* 93105 points

Hi Eren,

Kai's points about internal corrosion and degraded solderability are valid concerns. No one here has any way of knowing how these OPA2277MDTEP device have been stored over time and what environmental conditions they were exposed to.

TI is unable to provide any assistance with these devices. If it all possible I recommend not using this product.

Regards, Thomas

Precision Amplifiers Applications Engineering

+1 Marek Lis over 2 years ago in reply to Thomas Kuehl

TI__Guru 63010 points

Yes, Floor Life in the MSL level table shown below only relates to moisture/reflow related failures, which defines the criteria (JEDEC) for how long the bag containing the parts can be open under specified floor conditions before the parts must be bake dry before reflow assembly. However, it does NOT take into consideration other failure mechanisms or "shelf life" issues due to long term storage of the parts under unknown conditions.

0 Eren Erdogan over 2 years ago in reply to Marek Lis

Intellectual 280 points

Dear TI experts,

Thank you for your informative answers.

Regards
Eren

Amplifiers

Amplifiers forum

OPA2277-EP: MSL Problem and Baking