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OPA2277-EP: MSL Problem and Baking

Part Number: OPA2277-EP

Hello TI,

We plan to buy OPA2277MDTEP. MSL rating of this product is 3. The supplier's message is as follows:

“Our stock of Part Number OPA2277MDTEP  is not Dry Packed, please be aware that these parts may contain moisture.”

Can we use this product after baking? Is there probability of having trouble?



  • Hi Eren,

    hhm, this doesn't sound good. Take care, wrong storage conditions can result in internal corrosion and degraded solderability.

    Are the chips from a TI's authorized distributor? If not, there's even the risk that you buy a fake chip.


  • Hi Eren,

    Kai's points about internal corrosion and degraded solderability are valid concerns. No one here has any way of knowing how these OPA2277MDTEP device have been stored over time and what environmental conditions they were exposed to. 

    TI is unable to provide any assistance with these devices. If it all possible I recommend not using this product.

    Regards, Thomas

    Precision Amplifiers Applications Engineering

  • Yes, Floor Life in the MSL level table shown below only relates to moisture/reflow related failures, which defines the criteria (JEDEC) for how long the bag containing the parts can be open under specified floor conditions before the parts must be bake dry before reflow assembly.  However, it does NOT take into consideration other failure mechanisms or "shelf life" issues due to long term storage of the parts under unknown conditions.

  • Dear TI experts,

    Thank you for your informative answers.