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TLV9061: Effects of mechanical stress

Part Number: TLV9061
Other Parts Discussed in Thread: LF356

Hi Team ,

What characteristics are affected and what changes occur when external force is applied to the device?
Part : TLV9061IDPWR
Package : X2SON(DPW)

Best regards ,

  • The QFN and SON PCB Attachment Application Report says:

    Location of the thinner format QFN packages should be carefully considered when laying out the board design to avoid regions of extreme deflection during manufacture (see Figure 8). Excessive bending of the substrate can lead to package damage and should be avoided in the assembly flow.

    If you expect mechanical stress, better use a package with leads (SC70/SOT-23).

  • Hi, Clemens

    I need a small package. So, I need to use this package.
    For example, what happens to the device when the package is pushed?

    Thanks,

  • Hi Ken,

    many years ago when low input offset voltage OPAmps were rare and expensive I took the LF356 in DIL8 package and hand-selected a handful of OPAmps for lowest offset voltage (<0.1mV). To my surprise, after soldering the OPAmps directly into the prited circuit board afterwards, the input offset voltages were no longer <0.1mV but varried up to 2mV. It turned out that during the hand-selecting I pushed the LF356 into a DIL socket and mechanically stressed the package. By this pushing the die seemed to be bended slightly what caused a shift of input offset voltage.

    In your case, when the X2SON package is puched the die could also be bended slightly, but propably way less then when using a DIL8 package. So you could also see a slight shift of input offset voltage. Depends on the force you want to apply, of course.

    But never do bend the printed circuit board when having a X2SON package and other SMD components soldered on it. This should be strictly avoided. The possible consequences are crackings of component packages resulting in a total destruction.

    Kai

  • Planar pressure from above might be OK. But for any other kind of force, the package might get damaged; if the board bends too much, or if the force is from the side, the solder might break off.

    And there are no numbers. Mechanical stress larger than what happens during automated manufacturing is not tested for.

    In general, you should prevent mechanical stress to begin with. Where does this force come from? Could you use a potted PCB?