LMV225: θJt

Hi Kengo,

Please find the Thermal Metrics below for LMV225SD: 

Thermal Metrics (1)
Theta JA-High K (2) = 90.9 °C/W
Theta JC, top (3) = 81.3 °C/W
Theta JB (4) = 60.6 °C/W
Psi JT (5) = 4.0 °C/W
Psi JB (6) = 60.8 °C/W
Theta JC, bottom (7) = 11.2 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ΨJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ΨJB estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining RθJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case(bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Regards,

David Chaparro