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TLV9061: How to test ICs before using them in product assembly on sample basis for each lot / batch received from mfr./ vendor

Satish Ghariya
Intellectual 390 points
Part Number: TLV9061

Hi,

We are exploring to test/ functional test the ICs on sample basis from the different lots we receive. This we are planning to be done at Incoming QC i.e. before going in to assembly stage (pick n Place)  of the product.

We don't know how we can implement this, SO would like to know your thought on this. Some of the parts those we are using in our product is mentioned below.

  1. How we can test the above chips. Is there any method/ procedure for each chips to do functional testing
  2. What kind of jigs/ fixture we need to built
  3. We also would like to understand how other companies do to test these IC on lot/batch in there assembly house

1

TPS631000DRLR

2

TL081HIDBVR

3

TLV9061IDBVR

4

SN74AUP1T87DCKR

5

TXB0104PWR

6

LMR62014XMF/NOPB
  • 0
    Guru 140200 points

    Hi Satish,

    I wouldn't do that. The manufacturer spends lots of efforts to guarantee highest quality of the chips being packed in the tubes and reels. When buying the chips from an authorized distributor there's absolutely no need to check the chips before soldering.

    Kai

  • 0 in reply to kai klaas69
    TI__Expert 9000 points

    Hi Satish, 

    To add to Kai's comments, all TI parts are 100% tested to our electrical datasheet parameters (min/max specs) before we ship out. We also use an automated test equipment for our testing so it is difficult to recommend a specific test setup. 

    Please let me know if you have further questions.
    Thank you!

    Best Regards,
    Ashley

  • 0 in reply to Ashley Kang
    Intellectual 390 points

    Thanks for your response.. 

    So do you know any device manufacture who does this type of testing or heard this type of testing.

    Idea here is to avoid the protentional field failure so we would like to introduce some testing on each or some critical components. So suggest here 

  • 0 in reply to Satish Ghariya
    Guru 140200 points

    Hi Satish,

    most failures are caused by wrong storing of components (-> moisture sensitivity level), during the assembling, the soldering and the handling. The quality of components freshly delivered by an authorized distributor is your least problem.

    We never did any chip testing before assembling because we do not expect to get any wrong chips from an authorized distributor.

    Kai

  • 0 in reply to kai klaas69
    TI__Expert 9000 points

    Hi Satish, 

    There are different ways to test the board / application such as in-circuit testing (ICT) and system level testing that is done after the soldering and assembly process but before it is sent out the field. 

    Best Regards,
    Ashley