OPA2180: OPA2180IDGKR : baking conditions of (1) 120°C, (2) 90°C, and (3) 40°C

Hi H_K, 

OPA2180IDGKR's moisture sensitivity level is rated as MSL2.

H_K said:

1, Which is the temperature condition that can be put to production in remaining in the state of reel under : (1) 120°C, (2) 90°C, and (3) 40°C?

MBB refers to Moisture Barrier Bags. If a reel is out of MBB, and it is being stored within 30C and 60%RH in a humidity and temperature controlled environment within a year, then the part may not require to be baked. In other words, the absorbed moisture within the epoxy molding compounds are still acceptable, which it may not exceed the moisture level specified by IPC/JEDEC J-JTD-033 standard (acceptable to go through the reflow process without baking). 

If the reel is remained in the MBB sealed bag, and the humidity indicator card inside of the sealed bag did not change color, then the reel is safe to use per IPC/JEDEC J-JTD-033, no baking is required prior to the reflow process. (this means that the moisture has not protruded inside of the MBB and the epoxy molding materials are safe with low or no moisture content). 

The package body of OPA2180IDGKR is 1.10mm_max, and you shall use the following baking recommendation. 

Since the components are in the state of reel, then baking at (40C +5C/-0C and <=5%RH) is required, if the floor life storage conditions in note 4 are NOT met.  

H_K said:

2, Which conditions can the reel be removed and put to production in remaining in the state as a tape under: (1) 120°C, (2) 90°C, or (3) 40°C?

Answer is (3). 

90C or 120C baking process will "melt" the plastic tape or reel, and render the tape/reel inoperative.  

H_K said:

3, Could you explain what do the each temperatures for baking conditions these represent regarding (1) 120°C, (2) 90°C, and (3) 40°C  regarding OPA2180IDGKR?

Please pay attention to the verbiage and notes below Table 5 on p.9 of the AN-209 document.

Moisture absorption and desorption process are a function temperature and time. For MSL2 molding compounds, it takes up to a year to absorb the moistures specified by ≤ (30C & 60%RH) storage condition to an unacceptable moisture level for the reflow process. It takes up to 7 days to drive off or the absorbed moisture at (40C +5/-0C & ≤5%RH) in a tape/reel form.  

The IC components can handle the high temperature bake, say 90-98C or 120-130C, but the plastic packing around the IC components are unable to withstand the heat; and the tape/reel will be reshaped if the high temperature is exposed. The tape/reel material is usually made of polyprolyene or polyester. It is similar to place a regular empty thin water bottle in a 90C or 120C baking oven, and expected it to remain the same shape 1-2 hours later.  

If you have additional questions, please let me know. 

Best,

Raymond