This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LM6211: Rejectable surface crack and delamination's on lead fingers found during DPA, acoustic microscopy

Part Number: LM6211

A DPA was performed on MPN: LM6211MFNOPB per MIL-STD-1580C. We had three rejectable criteria, one of which (per PARA we wanted to get further information from TI.

During acoustic microscopy a total of 7 samples were found to have delamination's on lead finger's that allow water to ingress into the package. 

Based on the SAM images the delamination's were found on the lead fingers and a cross section on one of the samples was taken to see if the void allowed water ingress into the wire bond area. Based on the cross section (see image below), the die penetrant did not penetrate to the bond attachment area. 

If voids and cracks in the encapsulant do not reach the die or wire bonds/wires, in general, is the part less likely to fail (i.e. water exposure). Or if water ingress is able to reach the lead fingers, does corrosion propagate to wire bonds and die and ultimately cause a failure?

Is TI currently aware of issues of this PEM device from a quality perspective? Has there been similar defects observed on these type of COT parts? 

Are the delamination's shown on the DPA report typical characteristics of this device, specifically?

Has there been failures reported on this part, specifically with using the copper bond wires with regards to water ingress of these delamination's/voids and causing part failures that TI is aware of?

Any insight or additional information is welcome. (If images are not clear I can try to reattach as a separate file)