Given the guideline below:
The datasheet of OPA4277HFR/EM, 14-lead CFP(HFR) on page 17, section 10.1 layout guidelines recommended to soldered the leaddrame die pad to a thermal pad on the PCB, and the package outline of the CFP in the datasheet does not seem to have a leadframe... I wonder if the package has an expose metal pad on the bottom. Thanks,
What I can tell is there is no exposed pad (in the bottom) that can be connected to the thermal pad of the PCB. While the lid should not be connected to any lead as mentioned below:
I am confused about the guideline. Please help clarify. Thank you.