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OPA4277-SP: Thermal pad

Gerald
Genius 9580 points
Part Number: OPA4277-SP

Hi Experts,

Given the guideline below:

The datasheet of OPA4277HFR/EM, 14-lead CFP(HFR) on page 17, section 10.1 layout guidelines recommended to soldered the leaddrame die pad to a thermal pad on the PCB, and the package outline of the CFP in the datasheet does not seem to have a leadframe... I wonder if the package has an expose metal pad on the bottom. Thanks,

What I can tell is there is no exposed pad (in the bottom) that can be connected to the thermal pad of the PCB. While the lid should not be connected to any lead as mentioned below:

I am confused about the guideline. Please help clarify. Thank you.

Best regards,
Gerald

  • 0
    TI__Genius 9935 points

    Hi Gerald,

    You are correct, the package drawings do not show an exposed pad on this device. I reached out to the owner of the datasheet about this guidance but he is out of office until tomorrow. It is possible that an alternative package with a thermal pad was planned, or that this recommendation is a carryover from a similar device that does have a thermal pad.

    Thanks,

    Zach

  • +1
    TI__Genius 9935 points

    Hi Gerald,

    I can confirm the datasheet is in the process of being revised to correct this but it may take a month or so before the revision is published. For now please ignore this guideline as there is no exposed thermal pad on the device.

    Thanks,

    Zach