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LMP7704-SP: What is the allowed reflow soldering profile for this device/package?

Jim Brinkhurst1
Mastermind 44390 points
Part Number: LMP7704-SP

Hi experts

I am working the following question. Can someone help answer this?

We need to evaluate the temperature sensitivity of the 5962R1920601VXC, so we don’t overstress it when we put it on a flight board. 

The DLA SMD doesn’t specify the absolute maximum lead solder temperature as we see with other parts with a time limit in seconds. 

Could you tell us what the absolute maximum lead solder temperature is for the 5962R1920601VXC and any time profile recommendations/constraints?

Thanks for your help.

Best regards,

Jim B

  • 0
    TI__Expert 8535 points

    Hi Jim,

    According to this document about hermetic ceramic packages (https://www.ti.com/lit/an/slvaeu0/slvaeu0.pdf), the guidance for reflow is 235°C peak for 10s and the package body must never exceed 260°C. The document also calls out a maximum solder temperature of 300°C for 10s.

    I'm looking into the quality information for the 5962R1920601VXC to ensure the device specifications are consistent with the general guidance. If there is no reflow temperature specified for 5962R1920601VXC, I recommend following the guidance in the document above. I've reached out to the quality team about this but it may take a day or two to track down the relevant information.

    Thanks,

    Zach

  • 0 in reply to Zach Olson
    TI__Mastermind 44390 points

    Hi Zach

    Did you hear back from the quality team on whether 5962R1920601VXC is aligned with the 235°C/10 sec max reflow temperature?

    Also in the case this part needs to be manually soldered, could it withstand the 300°C/10 sec lead-temperature?"

    Best regards,

    Jim B

  • +1 in reply to Jim Brinkhurst1
    TI__Expert 8535 points

    Hi Jim,

    Thank you for your patience on this. I just noticed the link I posted above is broken, here is a new link to the document hopefully this one works.

    https://www.ti.com/lit/an/slvaeu0/slvaeu0.pdf?ts=1684442966094&ref_url=https%253A%252F%252Fwww.google.com%252F 

    There is no reflow or solder temperature specified for 5962R1920601VXC so the above document's guidance for ceramic hermetically sealed packages should be followed. That is 235°C for 10 seconds and a maximum solder temperature of 300°C for 10s, while the package body can never exceed 260°C.

    The only additional thermal information I could find is in the PCR where 5962R1920601VXC passes the following tests in accordance with MIL-STD-883.

    • Solderability, method TM2003 
    • Thermal Shock, method 1011
    • Thermal Cycle, method 1010

    Thanks,

    Zach