Hi Experts,
We are using LMH9135 in our latest design.
In LMH evm it is placed VIA24D12 in thermal pad of the IC. But in our case we will be able to place VIA20D10 due to space constrain. Please confirm whether can we go with 10 mils dril via. attaching the layout section for your reference.
Via highlighted in below image for better understanding. Via is not able to move or making big since the rf traces are going through the oposite side of board.
