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TLV9002: Contamination under TLV9002SIYCKR DSBGA package

Part Number: TLV9002

I have a design that uses many of these opamps as high impedance buffers. After several months in service, I've found contamination on the backside of some parts and below them on the soldermask. Laser Induced Breakdown Spectroscopy of the contamination shows it is an organic compound with a high percentage of copper. I'm seeing leakage currents as high as microamps. The contamination seems to spread out from solder balls eventually bridging them causing leakage.

While there are many other parts on the board, the contamination seems to be present only at these parts. This is the only chip scale package used on the board. All other ICs are plastic encapsulated.

Is there anything about the construction of DSBGA chip scale package that would make it more susceptible to contamination issues? 

  • Hi Craig, 

    Welcome to E2E! :) 

    How many parts are you seeing this contamination issue with (failure rate)? Is there correlation with certain lots or date codes? What other organic compounds were detected in the analysis?

    What is the assembly and soldering process for the DSBGA parts? Since you mentioned the TLV9002SIYCKR is the only wafer chip scale package on the board, have the devices been properly assembled and soldered? We have recommendations for assembly for wafer chip scale products in this apps note: 

    Please let me know if you have any questions.
    Thank you!

    Best Regards,

  • Hi Craig, 

    Do you have any updates or further questions on this? I will mark my last response as "TI Thinks Resolved" in the meantime, but please let me know if you have any questions.

    Best Regards,