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OPA627: Noise due to different packages

Part Number: OPA627

Hi experts,

My customer used CAN package of OPA627 and SOIC package of OPA627.

However CAN package has a bit more noisy than SOIC package. How should you consider the difference in noise between CAN and SOIC packages? It would be helpful if you could let us know if there are any precautions regarding noise reduction in SOIC packages.

Thank you for your help.


Taito Takemura

  • Taito, 

    1. This answer really depends on what category of noise you are asking about.  Intrinsic noise is noise generated by the amplifier itself.  Extrinsic noise is man-made noise (e.g. RF pickup, 60Hz noise).  The noise specified in an op amp data sheet is intrinsic noise.  
    2. From an intrinsic noise perspective the package should make no difference.  The die is the same in both packages.  The die is what determines the noise (not the package).
    3. If you are talking about extrinsic noise, the can acts as a shield so I would expect this may be more immune to noise pickup.  This is the opposite of what you see.
    4. PCB layout can impact noise.  So, if the layout is not equivalent for both designs this could account for noise pickup.
    5. There is a tolerance to noise.  You should expect about +/-10% variation in broadband noise. If you see very large differences you may have a damaged or counterfeit device.  If you purchased the device from an authorized TI vendor you don't have a counterfeit.

    I hope that helps.

    Best regards, Art