INA700: Clarification about the footprint POWERWCSP (YWF) | 8 classification

Ido Sasson

Part Number: INA700

Hello,

We would like to conclude if the footprint and soldering method of this device is like a BGA attention / or other type? Please clarify and check if there are also soldering requirements / application note since this footprint is unique and we need to define it correctly in our designs.

Full part number: INA700AYWFR

Package: https://www.ti.com/lit/pdf/mxcc018

Thanks.

over 1 year ago

0 Clemens Ladisch over 1 year ago

Guru 296910 points

See AN-1112 DSBGA Wafer Level Chip Scale Package, but it also says:

3.2 Special Considerations for PowerWCSP

SMI using solder paste for PowerWCSP should follow recommendations for Standard WCSP. Optimization of the SMT process for PowerWCSP is required to avoid issues, like tilting. Contact a TI representative for more information regarding PowerWCSP.

0 Peter Iliya over 1 year ago

TI__Mastermind 32395 points

Hello,

I am looking this over.

Best,

Peter

0 Peter Iliya over 1 year ago

TI__Mastermind 32395 points

Hello Appreciated Engineer,

PowerWCSP is subset of the BGA category. All of the necessary information for device layout is at the end of the datasheet. Are there any specific questions on Section 12 of the datasheet?

Sincerely,

Peter

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INA700: Clarification about the footprint POWERWCSP (YWF) | 8 classification