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TLV27L2: TILPC662AIM/NOPB, TILPC662AIMX/NOPB, TLV27L2CDGKR Photosensitivity

Timothy Lenz
Prodigy 10 points
Part Number: TLV27L2

Hello,

I am investigating the impact of light exposure for a design change on one of our products, and we use TI components for this build. Specifically, I am investigating whether any of these components has a response when exposed to visible light:

TILPC662AIM/NOPB
TILPC662AIMX/NOPB
TLV27L2CDGKR

My understanding is that the consideration of light exposure is a holdover from older SMDs that had exposed silicon on the package, so if there is not a clear answer on photoelectric response specifically, is it possible to confirm that the components are made with a nonmetallic casing via some reference?

Thanks,
Tim

  • 0
    TI__Genius 13620 points

    Hi Tim,

    Welcome to E2E! 

    Yes, light sensitivity and exposure will have to be considered for devices with exposed silicon like WCSP (wafer chip scale package). This characteristic is typically explained in our datasheets for applicable devices. 

    For the packaged devices listed, the chips are covered in black, epoxy-based non-metallic mold compound which can be verified via material content search on ti.com: https://www.ti.com/materialcontent/home 

    Please let me know if there are further questions.

    Thank you!
    Best Regards,
    Ashley