LT1014-MIL: I need thermal data for the J package (14pin CERDIP)

HI Joseph,

The LT1014-MIL on the J package,14pin CDIP Ceramic is a device introduced on 1989, over three decades ago, so it does not include the IC package thermal metrics/specifications in the datasheet. Let me see if I can find any other information about this legacy device. Allow me a couple of days.

Thank you and Regards,

Luis

That is about how old the product is I am trying to support, so that sounds about right.

Thanks!

Joe

Hi Joe,

I will discuss with the packaging team to see if we can obtain the IC package thermal metrics/specifications for this device.

I suspect this may take several days, as most likely they will need to perform this measurement.

I will provide an update as soon as I have additional information from the packaging team.

Thank you and Regards,

Luis

Is there any way to get an official report or memo with the above results?  I will need more than a screen shot.

Also, I need a Tj(max) figure as well.

Thanks,

Joe

Hi Joe,

TI's standard procedure is to calculate the parameters above from a standardized modeling process that accounts for die size, die attach, leadframe, and mold compound.  This is the same process we use for all of our released devices, we do not have any formal documentation that accompanies it besides the fact that the numbers are then entered into a data sheet. If you have an example of something similar then we can look into it but I am not aware of a formal way of offering the data otherwise.

Also, as far as I am aware, we have never provided a Tj(max). Is this a requirement for your design?

Regards,
Mike

Is there a way to continue this via direct email?

Basically, we are trying to sub a part for a 30+ year old design.  I am trying to map datasheet parameters from the proposed part (LT-1014) to the old part.  Tj(max) is on the datasheet for the original part as are some other parameters that are missing for the LT-1014.  When we have a parameter that doesn't map, we are left with a hole that we have to fill with analysis (which, as you are likely well aware, is expensive).  So, having a number to compare against makes life a lot easier, even if that number is higher or lower than the value on the proposed part.

I'm surprised that thermals haven't been a thing for TI.  I am used to seeing them on datasheets (R(thetas) & Tj(max), specifically) but I can't say that I've actually *looked* at the TI datasheets an noticed their absence.  I get that R(theta) is not a perfect way to approach thermal design.  That is a topic which we could spend a lot of time with but isn't really germane to the need I have at the moment.

Having whatever you have in a datasheet would be awesome, but since that horse is out of the barn, we need *something*.  A direct email might work, or a company logo'd memo.  Traceability is the keyword.  I don't need the raw data, I just need to be able to point to it in such a way that someone months or years from now can retrace my steps.

If we can converse directly, I can share more info, which may help you understand my point of view.  Do you have a way to lookup my email?  Is there a way I can reach you through channels?

Hi Joseph,

Yes, sure, I'll reach out for a friend request so you don't need to publish your email here and we can continue over email.  I'll close this post but it can be opened again if need.

Regards,
Mike

OK, thanks!