Tool/software:
Hi
We made X-ray structure of this product and found that the internal structure was inconsistent and the appearance was different
Could you please help to confirm the reason and whether it affects the use
thank you
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Tool/software:
Hi
We made X-ray structure of this product and found that the internal structure was inconsistent and the appearance was different
Could you please help to confirm the reason and whether it affects the use
thank you
Hi Yingjiao,
As Clemens indicated, OPA627A was discontinued. If the IC is not purchased from TI authorized distributor, we have no ways to provide the traceability on these parts.
OPA627AU package (SOIC) is still active, I can find out when you are able to purchase these. You may have to make or purchase adapter from SOIC to DIP package, or find alternative part to replace it (difficult for DIP package).
Please let me know if you need further assistant.
Best,
Raymond
Hi Yingjiao,
FYI, OPA627AU part is still active, though it is out of stock currently.
If you are interested, I can find out when it will be available.
Best,
Raymond
Hi
Could you please help to confirm why the internal structure on the pictures we feedback is different, and why the appearance is also a little different
You did not answer my question. Where did you acquire them from?
The OPA627 is a well-known audio opamp, and the DIP package was discontinued. This makes it very likely that both are counterfeit, and that the electrical characteristics will be different.
The only way to get an OPA627 now that is guaranteed to work is to
Hi Yingjiao,
Let me get it back to you on this.
There are many counterfeits on the part. I normally do not deal with Rochester Electronics, and I do not know where they acquired these ICs from. I need to contact the engineer who works with the distributor.
The SOIC to DIP adapter looks like this. You may consider to work around the issue. I was told that OPA627AU may be available soon.
Best,
Raymond
Hi Yingjiao,
the appearance was different
Could you please help to confirm the reason and whether it affects the use
If these OPA627 PDIP packages were purchased from Rochester Electronics, who is one of the authorized TI distributor, it is likely that these parts are authentic.
I compared the wire bonding patterns, and it seems that two parts are identical. The X-ray images reveal some dark and light grey scales, it is possible that these are due to the differences shown in the paragraph below. In addition, the OPA627 physical outer markings do show the correct product patterns that defined in the product.
Please complete the counterfeit request form form and submit it to our customer support center. We are the technical support application team, and do not support the sample returns and counterfeit request process.
https://www.ti.com/lit/ml/ssdl004c/ssdl004c.pdf
If you have additional questions, please let us know.
Best,
Raymond
Hi Yingjiao,
Yes, the manufacture site is different. The X-day image show that it has the same die. I don't believe that the darker area is the Si die; it is likely air pocket or stress relief layer to lower the epoxy molding stress onto the Si die surface. the bonding pad is where the Si die resides, which is below the darker grey layer.
Please submit the counterfeit request form, and this matter should be resolved by the customer support team. I do not have the knowledge how to proceed the matter.
Best,
Raymond
Hi Yingjiao,
The dark region is shown in red. I do not know exactly what it is in it, but it is possible a piece of stress relief thin plastic layer, which is used to avoid direct contact of the epoxy cured molding compounds.
If these were ordered from Rochester Electronics, they are likely authentic.
If you have other questions, please let us know.
Best,
Raymond