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PGA308: PGA308AIDRKT PCB footprint

Part Number: PGA308

Tool/software:

Is there a document showing the PCB footprint for the DRK package for the PGA308? The data sheet and package drawing do not show the actual recommended footprint. I did download it from Ultra Librarian (direct link from TI), but the PCB vendor I'm using double checks all of the footprints against manufacturer drawings. 

Scott Metzger 

  • Hi Scott, 

    Welcome to e2e :) 

    Earlier this year, we received an e2e pointing out an error in the land and stencil drawings for the PGA308 - DRK package: PGA308: DRK Package Measurements in the Datasheet - Amplifiers forum - Amplifiers - TI E2E support forums

    In order to fix this mistake, the packaging team updated the land pattern to follow the current standards. 

    Here is a screen shot of the differences between old and new land patterns. The old land pattern are the red lines. The new land pattern is the orange areas. The current practice is to extend the PCB pad 0.2 mm outside the package edge. As you can see the old design extends much further past the package edge. Also, the via size has changed. Standard vias are now 0.2mm diameter instead of 0.3mm diameter. We also try to keep the vias from being located under solder paste after printing. This is why the via pattern is different.

    I downloaded the files from Ultralibrarian and they seem to be the old land pattern. 

    I have put in a request to have the land patterns for this device updated in ultralibrarian.
    I am not sure why the ePOD online isn't showing the NEW land patterns, I have reached out to the packaging team but expect some delay as the engineer is out sick. 

    All the best,
    Carolina 

  • Hi Scott, 

    Heard back from the packaging team that the newest ePOD was passed along in our system but didn't make it to ti.com. I expect it to be online by end of week - once that is up I will request the new ultralibrarian. 

    All the best,
    Carolina 

  • Hi Scott, 

    Okay - last update for today - promise. 

    Here is the latest landing pattern: 

    I expect it to be on the web by end of week. The ultra librarian request takes up to 3 days, this has also been submitted. 

    All the best,
    Carolina 

  • Thanks for all of the updates!. It looks like the attached image is missing the required info for the copper and recommended solder mask expansion. My PCBs are being built to class III (fab and assembly). The board house doing a 100% review on footprints and will need a drawing showing the following layers:  copper land, solder mask expansion {bulk recommendation is OK}, paste mask {shown in your third post}.

    Scott Metzger

  • Hi Scott, 

    The datasheet has been updated, could you please check it to see if it has everything you need? Single-Supply, Auto-Zero Sensor Amplifier with Programmable Gain and Offset datasheet (Rev. B)


    The ultralibrarian effort is underway. 

    All the best,
    Carolina