Tool/software:
The solder Heat resistance (actual value) Flow condition for TL082CP is "300degC 10s" is described in the datasheet though, could you give any recommended values (to ### area) under "265C ##sec" or "###C 8sec" conditions? (It's came from our customer's soldering criteria.)
Hi Tahara,
The JEDEC standards should be referenced by the customer for reflow. Here is a Ti document regarding recommended soldering profiles.
https://www.ti.com/lit/an/snoa292j/snoa292j.pdf
The datasheet describes the absolute maximum condition that must not be exceeded otherwise it can permanently damage the device. As long as the customer does not violate the absolute maximum spec there shouldn't be an issue.
Best Regards,
Chris Featherstone
