• State TI Thinks Resolved
  • Locked Locked
  • Replies 1 reply
  • Answers 1 answer
  • Subscribers 46 subscribers
  • Views 62 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

OPA2314-Q1: Question about PCN

Chase Jeong
Mastermind 6825 points
Part Number: OPA2314-Q1

Tool/software:

Dear TI experts,

my customer got PCN of OPA2314AQDRQ1, and the docunemt says about additional BOM materials.

(PCN no. is 20250325001.2)

And here is my 1st question : What is difference between "Mount Compound" and "Mold Compound"?

I can see many description about mold compound in google and even material contents, but I cannot find any information about mount compound.

(It should be shown in material contents sheet but I cannot see it.)

And 2nd question about this PCN ;

In the lash part of PCN, I can see "Automotive Qualification Summary" but I cannot see the contents about OPA2314AQDRQ1. Can you check it?

Please check these issues. Thanks.

Best regards,

Chase

  • 0
    TI__Guru 57846 points

    Hello Chase,

    "Mount" compound is the "goop" (glue) that holds the die to the leadframe. It is like a little drop of fancy super glue.

    "Mold" compound is the Epoxy that makes the molded body of the device (the black stuff you can hold).

    The OPA2314AQDRQ1 qualification is done by "QBS", or "Qualification by Similarity". A similar device using the same materials was tested since this is an Assembly only change - so nothing electrical. That is why there are several different devices listed in the "Products Affected". It would cost too much to test every device using the same assembly change - so only one is tested. In this case, the SN65HVD1040AQDRQ1 was the test vehicle.

    This is allowed in the AEC-Q100 specification.