LM111: Thermal Resistance, Junction to Ambient value

Hi Marvn,

I looked at multiple CDIP packages and I'm unable to find any junction to ambient value in the thermal table. I'm wondering if the assumption is that the leads are so long that the package sits above the PCB; so, the only path of heat dissipation would be through the package itself.

Hi Marvin,

Since the CDIP package dominates the equation, see the LM158-N - the die size is equivalent and the package materials are the same.

Industry-Standard Dual Operational Amplifiers datasheet (Rev. AB)