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LM211: LM211DR IC FCT test fail issue

Carol.li Carol.li
Prodigy 65 points
Part Number: LM211


Tool/software:

Hi TI friends,

Our production line happened LM211DR IC FCT test fail issue, F/R: 60/416=14.4%, we have done below verify:

1.  The soldering is OK from X-ray confrim;

2.  The soldering is OK from microscopic examination;

3.   The defect phenomenon disappeared after re-soldering;

4.  The IC was directly heated with a hot air gun (200°), and after cooling and testing, the defect phenomenon disappeared;

5.  Bake the PCBA  with 150°&3H , the defect phenomenon disappeared;

Could you help to confirm and reply below questions:

a. Why the test result is difference at different tempratures? 

b. The influence of temperature on the test resulr of the IC ?

Thanks.

Carol.li 

  • 0
    TI__Guru 62356 points

    Hello Carol,

    There have not been any changes to the LM211, and we have not received any other reports of failures.

    Temperature has many effects on a device. We need more details on the failure (schematic/test results of good and bad) to say what the cause is.

    Is it working at room temp, or only when heated? Is this a new design? Were these devices properly stored? Sealed Bag?