Tool/software:
IMDS Node ID 1096264700 / 2.00 is rejected in IMDS system.
The IMDS record has been rejected. Please review and modify record as described below and re-submit data for acceptance.
1. In Component: IC AMP RtR SING LOW OFFSET SOT23-5 TLV316QDBVRQ1 Material: Sieg (Silicon electronic grade, e.g. for Wafer)
Sieg (Silicon electronic grade, e.g. for Wafer) . This MDS has been hidden in IMDS and must be replaced.
2. In Component: IC AMP RtR SING LOW OFFSET SOT23-5 TLV316QDBVRQ1 Material: Die attach adhesive (Ag)
Please choose the Recyclate information (e.g. Does the material contain recyclate?: Yes / Not applicable / No ). Please choose the correct one as per the material (IMDS Rec.001, Rule 4.4.2.M&O).