Dear sir/mam,
We have been using your devices in many of our designs for various applications. In the process of Baking the MSL level component, we have encountered a problem as below;
"During the process of baking the MSD component at +125 °C in a chamber for 48 hours, the chamber door was opened in the middle of the 48 hours duration (around 44th hour) to introduce a tray consisting of PCBs into the same chamber which also needed the same baking temperature of +125 °C for 4 to 6 hours duration."
So, we have a few queries related to the above process.
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Can we open the chamber door in between the baking duration - to add another batch of MSD components for shorter duration or even longer duration or to add PCBs, etc.
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What is the effect on the component which is undergoing baking when the chamber door is opened before the completion of baking duration.
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Do we need to extend the baking duration if the chamber door is opened in between the baking process.
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Do we need to repeat the baking for the complete 48 hours duration.
Please suggest/recommend us further course of action need to be taken to resolve the above said issue.
Thanking you and looking forward to hear from you soon.
