Part Number: INA260
I am using the INA260 as a high side sensor. I have Vbus tied to Vin. I am using a 2 layer board - top layer signals, bottom layer ground and some power. I ran into a bit of a layout problem with the INA260. The chip is at the bottom of the board, and the SCL, SDA, Vs, and Current Alert signals have to go to the top of the board. I ran those signals up the middle of the INA260 on the top layer, and the only way I could connect Vbus to Vin was using 2 vias to drop down to the back layer for a short run across the chip. Do you see any issues with this layout, other than poor component placement from the start? In my defense, this is a retro-fit to an existing layout, so I didn't have a lot of choice for component placement.
