I've got a question about the OPA2211A. We're using this on a design and I noticed that we've connected the Thermal pad underneath the part to GND. In the datasheet it says we should connect it to the Negative voltage which in our case is -5V. This board is operational in the lab, so nothing catastrophic has happened, but I am concerned about the thermal performance and how far we may be off the specs. Can TI give us an idea of how bad this might be? Is this something we must change? I know you can't tell us too much given everything is application specific, but I'm just looking for a ball park estimate of what we might expect.