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OPA1S2384: Thermal Pad Connection

Part Number: OPA1S2384

Hello I am working on a design with the OPA1S2384. The chip comes in a single package with designator: DRC (SON-10). The data sheet for the package indicates that it has a thermal pad, however the datasheet for the chip makes no mention of the pad. Should this pad be left floating, connected to V-, or does this variant not have the thermal pad?