The datasheet for the ONET2804T recommends 2 single layer caps between 270pF and 680pF to be bonded to the VCCI pads. If the ONET2804T will be mounted direct to the laminate and not to a ceramic substrate, can the VCCI connections be bonded to a pad on the laminate and MLCCs placed on the PCB for decoupling? The caps would be placed adjacent to the bonding pads.