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OPA2211A: left thermal pad open?

Part Number: OPA2211A


I'm P2P displacing a competition part with OPA2211A. I know soldering the thermal pad to the printed circuit board is required, but on the board of previous project, there is no thermal pad. I would like to know is there any specified performance missing if I left the pad open.


  • Hi Jerry,

    section 10.1.1 of datasheet clearly says that the pad must be soldered to the PCB:

    "Soldering the exposed pad significantly improves board-level reliability during temperature cycling, key push,
    package shear, and similar board-level tests. Even with applications that have low-power dissipation, the
    exposed pad must be soldered to the PCB to provide structural integrity and long-term reliability."

  • Hi Jerry,

    The thermal pad is the electrical connection to the backside, or substrate, of the OPA2211A. The expectation is the OPA2211A thermal pad will be soldered to a PC board pad tied to V-. If it floats the necessary electrical isolation between transistors and other IC components cannot be assured. That can lead to degraded dc and ac performance, and in a worst case scenario latch-up probelms.

    The OPA2211A electrical performance hasn't been characterized with the thermal pad floating. Even if the amplifer seems to function okay with the thermal pad floating do note that the die temperature will be higher than when it is soldered to the board. Because of temperature effects and the questionable isolation on the die some dc and ac parameters may be degraded. Sorry I can't be more specific, but the OPA2211A is not intended to be operated in this way.

    Regards, Thomas
    Precision Amplifiers Applications Engineering