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OPA569: Breadboarding

Don Falkowski
Prodigy 10 points
Part Number: OPA569

What is recommended method for bread boarding the OPA569.  We would like to bench test the chip and not sure how to heatsink it?

  • 0
    Guru 140200 points
    Hi Don,

    I would use a test board with the layout of figure 18 of datasheet. The vias within the thermal pad should go to at least one solid copper plane, as explained on page 18/19 of datasheet.

    Kai
  • 0
    TI__Guru* 93105 points
    Hi Don,

    The only practical way to evaluate the OPA569 electrical performances is to follow Kai's advice regarding the Fig. 18 information, and I would add the Fig. 16 information. Additionally, Fig. 12, "Thermal Resistance vs Circuit Board Copper Area," provides useful information regarding the heatsinking performance provided by the PC board copper. Once you have an idea of how much power your application will dissipate, the graph should help you determine how much copper area will be required.

    Be sure to observe the Page 2, Pin Configuration NOTE (1); PowerPAD pins 1, 10, 11, and 20 and the PowerPAD should be connected to the most negative supply (V–) in either single or split supply configurations. This is important and required for proper OPA569 operation.

    Regards, Thomas
    Precision Amplifiers Applications Engineering