Because of the holidays, TI E2E™ design support forum responses will be delayed from Dec. 25 through Jan. 2. Thank you for your patience.

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

ONET8551T: Not Package to mount on a PCB

Part Number: ONET8551T
Other Parts Discussed in Thread: ONET1151P,

Dear TI experts,

I was looking into this part in order to have a TransImpedance Amplifier from an external photodiode detector (FINISAR PhotoDetector). I was planning to have this TIA amplifier with one more Limiting Amplifier like ONET1151P. 

But I saw that there is no package for the ONET8551T to mount on a PCB. What would you suggest me to do?

Thank you!

Juan.

  • Hello Juan,

    The ONET8551T is intended to be wire bonded in order to minimize the parasitics in your application. This is because of the devices sensitivity to parasitics which may cause it oscillate. Under the "Recommended Operating Conditions' section you will find the suggested photodiode capacitance and wire-bond inductances needed for regular operation of the ONET8551T.

    Best,
    Hasan Babiker

  • I don't know about wire bonding, does TI do it? Can anyone guide me or tell me where to look for? Could be done for this part for few samples? (Just doing prototype). Suggestions are very well received :) 

    Thank you Hasan. 

  • Hello Juan,

    Unfortunately, TI only provides the device in die form, and does not bond the die onto a substrate. You can find at the "Layout Example" section of the datasheet, the recommended setup for the device.

    Best,
    Hasan Babiker