INA3221: Layout pattern guideline

Hello Jason,

Thanks for reaching out on the forum. As of now, I can only point you towards figure 55 of the datasheet. I am currently reaching out to the applications engineer who was responsible for that EVM. If possible, I will see if he can forward the layout files if you are interested. However, a quick glance at the EVM layout suggests a space-conscious customer would likely want to make several adjustments to that layout. The key item I would make sure your customer does for layout would be placing the decoupling capacitor as close to the supply pin as possible. If the customer has a very noisy input, they may want to use an input filter, otherwise they should leave it out as it will increase their measurement error.

Hello Jason,

I suspect I may have misinterpreted your request.  If you are wanting the board layout for the RGV package, we may not have a document for that.  I will see if I can reach someone in packaging who might have such a document.  In the meantime this document might help.

Hello Patrick,
Our end customer ask Vendor to provide the layout pattern guideline of INA3221.
the document you share is not helpful.
could you please help it?

BR,
Jason

Hello Jason, Sonny,

I reached out to our packaging team and for now it seems we do not provide a land pattern diagram for that type of package.  However, we do have another document that provides more details on how to generate your own land pattern here.  While it may not explicitly show an example of the land pattern for the RGV package, it does provide guidelines for qfn packages, which includes the RGV package.

Parick,

I am so sorry to push you again. Customer need TI provide the exactly land pattern diagram for INA3221.

If the document would work, could your team to generate land pattern diagram for INA3221?

They used to suffer the issue before without following vender land pattern guideline.

That's why OEM strong ask ODM to get this data from Vendor.

Customer mentioned that if we could not provide it, they will considerate others who could provide it.

BR,

Jason

Hello Jason,

I managed to reach someone a little more helpful in our packaging department. As per their instructions, I have submitted a request on the formal system that catalogs and distributes the requests to a designated engineer/illustrator. I will try to give you an update within the next day or so of when they should be able to completely process that request.

Hey Jason,

We have got a preliminary draft of the land pattern document generated now. However, there is one or two items that need to be reviewed on it. After those items are addressed, we should have what your customer needs available on the web.

hello Patrick,
So, when could we get it?
Could you provide it to me through email first before releasing on ti.com?

BR,
Jason