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Original question:

[FAQ] Getting Started on TI E2E™︎ design support forums

TLV8542: Soldering information

MARKUS FRANK
Prodigy 30 points
Part Number: TLV8542

Hi,

I need soldering information for the TLV8542 RUG package. I can't find this anywhere. Would a conventional oven going up to around 230 deg C for about 2-3 min using solder paste harm the package in anyway?

Best regards,

Markus

  • 0
    TI__Expert 6625 points

    Hi Markus, 

    This information is available in TLV8542 product folder. You can click on "Ordering & quality" and check the "MSL rating/peak reflow" as shown below. 

    For more information on reflow profile please refer to this document: http://www.ti.com/lit/an/spraby1a/spraby1a.pdf. If you look at Page 4, the chart is generated based on JEDEC standards. 

    To answer your question, 2-3 minutes at 230C may be too much for the device to handle. Based on the chart, you should be okay with 1 minute at 230C or 30 seconds at 260C. 

    I hope this information is useful to you. 

    Regards,

    Bala Ravi

  • 0 in reply to Bala Ravi
    Prodigy 30 points

    Dear Bala,

    Thank you very much for the information. This is somewhat difficult to compare with how I do it. I use a conventional oven without any ramping simply heated up to 230 deg C and then I put the PCB inside and remove it shortly after the solder paste has melted. This is around 200 deg C. With ramping the complete process is much longer but with intermediate temperatures and only a short time peak temperature. Hopefully, the device will not be damaged by my crude method. I'm getting some very strange measurement results now but the reason may be some other than a device destroyed from heat.

    Best regards,

    Markus