• State TI Thinks Resolved
  • Locked Locked
  • Replies 2 replies
  • Answers 1 answer
  • Subscribers 49 subscribers
  • Views 192 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LM393-N: DSBGA Package Question

Darren (FAE)
Expert 5483 points
Part Number: LM393-N
Other Parts Discussed in Thread: LM393B

I have a really specific question regarding the DSBGA packaging for the LM393-N...

There is a customer considering this package, but they are nervous about the way these DSBGA packages have the epoxy/resin/etc coating on the "top", while the bottom (where the balls are) is basically just a "solder mask" (according to AN-1112 application report)

They have a strenuous pre-acceptance device packaging test (details via personal email), and are concerned about the robustness/reliability of this "thin solder mask" to hold up to the testing.

Is there any information/data that could be shared (even via email) regarding the strength/resilience characteristics of the thin "undercoating" of the package?

Regards,

Darren 

  • 0
    TI__Mastermind 23425 points

    Darren

    I’ll see what information I can find tomorrow but did you show your customer the new leadless package option for lm393b? It’s a 2x2 wson package that’s sampling now. It sounds like that’s a better option for them with improved performance.

    Chuck

  • 0
    TI__Mastermind 49966 points

    Hi Darren,

    The bottom of the die is covered in a thicker-than-normal polymer passivation -  it is not soft "solder-mask" as you would have on a PCB. So the bottom of the die is sealed as well as any packaged device.

    Is there a particular area of concern? When properly mounted, the bottom of the die should be physically protected by the PCB. I would be more concerned about the other SMT passives around the device. If moisture or the environment is a concern, then the entire assembly should be sealed with a conformal coating or paraffin to protect all components.

    See the Packaging Appnotes "DSBGA" section - but you already found the major appnote (AN-1112).

    http://www.ti.com/support-packaging/packaging-resources/SMT-and-application-notes.html#dsbga

    I'll send you internal links to the packaging group contacts.